Office: +972-4-9553435

Fax: +972-4-8146203

Kiryat Bialik, Israel

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WELCOME TO WAFER TECHNOLOGIES LTD

ABOUT US

Twisting the future

Wafer Technologies is a new disruptive start-up developing unique wireless communication systems for various applications, ranging from Cellular systems and products current and 5G, Wi-Fi access points and clients and all the way to high frequency systems such as SATCOM, Point to Point and Point to Multi-Point at the Micro-wave and millimeter wave range for Space and terrestrial systems.

 

A CAREER AT WAFER TECHNOLOGIES LTD

Start Your Next Position with Us

Wafer Technologies develops cutting edge communication, microwave and antennas technologies.

The core team of experts is expanding and seeking for excellent people like you!

Are you focused, self-motivation, ambitious, expert in your domain and look for you next big challenge?

We’re hiring for a variety of positions across several departments! Search our job listings to see if you’re a perfect fit for a career in engineering with our team.

MICROWAVE AND ANTENNAS ENG.

Position 101

As an Antenna Design Engineer working for Wafer you would join the core development team that is now changing the world of wireless communication around the globe.


You would lead the development of unique antennas and and RF front ends from 500MHz all the way to 90GHz enabling wireless connectivity to the Internet back-bone around the world in the most spectral efficient and cost effective way possible.


We do in 6 months what others try to accomplish in 2 years!


Minimum skills:

  1. Minimum of BSc. In Electrical Engineering or equivalent with emphasis on electro-magnetic, Antennas, MW and wireless communication.

  2. Minimum of 5 years hands on experience designing antennas, Passive micro-wave components and devices with direct experience in Micro-strip, strip line and printed technology.

  3. Practical experience of steerable beam antennas and integration into low-cost and mass production products.

  4. Design experience with HFSS and Ansys designer and or equivalent.

  5. Experience using Matlab and writing scripts for complicated simulation models.

  6. Hands-on experience in testing antennas in Far Field and or Near Field Chambers;

  7. Lab experience measuring S parameters and RF sub-systems;

Desired Skills:

  1. Experience developing antennas into complete communication systems for either point to point and or point to multi-point, clear know how of communication theory and link budgets.

  2. Clear Understanding of transmission line theory and distributed systems.

  3. Experience launching sub-antenna systems into mass production.

  4. Understanding of various manufacturing processes and technologies, such as die-cast, printed technologies, materials and integration.

  5. Experience designing conformal Radom’s for low and high frequency products.

  6. Understanding of the RF chain for transmits and receives systems.

  7. Radar fundamentals knowledge is a plus.

  8. Military and/or defense experience is a plus.

  9. Job Location in Qiryat Bialik – Wafer Technologies R&D Center;

RF DESIGN ENG.

Position 102

As an RF System Engineer working for Wafer you would join the core development team that is now changing the world of wireless communication around the globe. You would lead the Radio System engineering of our core unique wireless products and system ranging from consumer handheld product and devices to large deploy-able wireless communication systems that would be mounted on Houses, embedded into vehicles and airplanes.


You would need to provide innovative solutions from an RF System design perspective. You would specifically lead the Definition of the system requirements, RF system design and defining and implementing the core RF technologies behind our flat antennas and radio products, you would have a leadership role in orchestrating how our systems and products would operate and Integrate into a complete system and or network. Lead the chain from Baseband to waves in air including Integration and customer use.


Our Team in Wafer does 6 months what others try to accomplish in 2 years!

Minimum skills:

  1. Minimum of BSc. In Electrical Engineering with Emphasis on Radio Engineering, Wireless and wired communication theory and signal processing.

  2. Minimum of 5 years hands on experience defining and designing RF and Wireless communication systems and products from as low as 500MHz all the way to millimeter wave frequencies.

  3. Building proper feasible link-budgets analysis for various systems and products for point to point, point to multi-points and networks.

  4. Hands-on experience designing RF systems and boards from concept and feasibility through schematics and layout all the way to Production and testing, High and low power systems.

  5. Direct experience designing and building transceiver chains, from the Antenna port to the modem, LNA’s, Mixers, Filters, PA’s, PLL’s , VCO’s, synthesizers from 500MHz to 90GHz;

  6. Hands-on experience for analysis and building theoretical models to accommodate the buildup.

  7. Experience with Simulation tools such as Ansys Designers, Keysight (HP/Agilent) ADS, Matlab Simulink and or equivalent.

Desired Skills:

  1. Antenna theory and transmission line theory in depth knowledge.

  2. Experience testing and integrating radio systems in the lab;

  3. Mass-production experience is a plus but not a must.

  4. Experience with Phased array antenna design and active design of phase shifters and alike.

  5. RFIC experience is a plus.

REALTIME SOFTWARE ENG.

Position 103

As a Real-time Software Engineer working for Wafer you would join the core development team that is now changing the world of wireless communication around the globe. You would lead the development of unique wireless products and system ranging from consumer handheld product and devices to large deploy-able wireless communication systems that would be mounted on Houses, embedded into vehicles and airplanes and you would need to provide innovative solutions from a architecture, processor selection, SW skeleton and working all the way to an operational SW deployed around the world.

You would specifically lead the Definition of the system requirements, Control and CPU system design and defining and implementing the Core algorithms, TT&C and Communication protocols behind our terminals and radio products, you would have a leadership role in orchestrating how our systems and products would operate and Integrate into a complete system and or network. Lead the Complete System Integration and management of all the sub-systems of our terminals, and customer use.


Minimum skills:

  1. Minimum of BSc. in SW Science, Computer Engineering or equivalent.

  2. Minimum of 5 years hands on experience developing real-time SW in real-time OS;

  3. Experience in designing SW architecture.

  4. Hands-on experience in embedding libraries, including IP stack.

  5. Experience in target processor selection, including Flash and RAM size assessment.

  6. Hands-on experience in developing debug environment.

Desired skills:

  1. Experience in leading a team.

  2. Hands-on with Linux.

  3. ARM oriented development, including related tools.

MECHANICAL ENG.

Position 104

As a Mechanical Design Engineer working for Wafer you would join the Core development team that is now changing the world of wireless communication around the globe. You would lead the development of unique wireless products and system ranging from consumer handheld product and devices to large deploy-able wireless communication systems that would be mounted on Houses, embedded into vehicles and airplanes.


You would need to provide innovative solutions from a mechanical design perspective, including Radom designs, design for mass-production, and design of mounting and integration.


We do in 6 months what others try to accomplish in 2 years;


Minimum skills:

  1. Minimum of BSc. In Mechanical Engineering or equivalent with emphasis on electronic housing design, static and dynamic systems, consumer products and systems.

  2. Minimum of 5 years hands on experience supporting mechanical design for antennas, electronic packaging, mounting equipment, Radom’s, positioners for accurate pointing systems and conformal structures;

  3. Practical experience of positioners and mechanical alignment systems for Antennas and or electro-optical systems.

  4. Direct Mechanical design experience with Solid-works or equivalent.

  5. Direct Experience for sheet metal design, design for Die-cast and Injection Molding as well as 3D printers and unique printing technologies.

  6. Hands-on experience assembling and integrating electronic systems, RF radios and Antenna systems into a mechanical packing for test set-ups and complete products.

  7. Hands-on experience for stress analysis and thermal analysis for Radio systems.

Desired Skills:

  1. Experience designing mechanical packaging and or Mechanical design of antennas into complete communication systems for either point to point and or point to multi-point.

  2. In depth experience of thermal distribution and design for power dissipation.

  3. Understanding of various manufacturing processes and technologies, such as die-cast, printed technologies, materials and integration, sheet metal design and manufacturing, stamping, semiconductor manufacturing process such as LCD’s, wafers etc. a BIG Plus!

  4. Experience designing conformal Radom’s for low and high frequency products.

  5. Mass production experience and design experience in the semi-conductor industry is a plus.

MATERIAL/CHEMICAL ENG.

Position 105

As a Material Science Design Engineer working for Wafer you would join the Core development team that is now changing the world of wireless communication around the globe. You would lead the development of some of our core manufacturing technology and processes for our unique wireless products and system ranging from consumer handheld product and devices to large deploy-able wireless communication systems that would be mounted on Houses, embedded into vehicles and airplanes.


You would need to provide innovative solutions from a material engineering design perspective, including Radom designs, design for mass-production, and research and development of various materials for thermal, RF and mechanical constraints. You would be specifically developing our core manufacturing process technology around RF, Antennas and Radio systems.


We do in 6 months what others try to accomplish in 2 years;


Minimum skills:

  1. Minimum of BSc. In Material Science engineering or equivalent with emphasis on Radom design, conformal structures and materials and more.

  2. Minimum of 5 years hands on experience of R&D work developing Radom’s for high and low frequency antennas, experience with Ferro-electric material and understanding of chemical Oxides, for either the Micro-wave Industry or for the semi-conductor industry.

  3. Practical experience and lab experience building various compounds, and mixtures to form Mothers for Radom’s, and defining and implementing manufacturing processes of different materials.

  4. Hands-on experience building structures based on developed processes, understanding of conductive oxide materials such as ITO and others used for the semi-conductor industry.

  5. Hands-on experience for analysis and building theoretical models to accommodate the buildup.

Desired Skills:

  1. PHd. Material Science and or Equivalent.

  2. Semi-conductor Industry experience, for either silicon manufacturing is a big plus.

  3. Experience designing conformal Radom’s for low and high frequency products.

ORGANIC MATERIALS' CHEMICAL/MATERIAL ENG.

Position 106

As a Material Science Design Engineer working for Wafer you would join the Core development team that is now changing the world of wireless communication around the globe. You would lead the development of some of our core manufacturing technology and processes for our unique wireless products and system ranging from consumer handheld product and devices to large deploy-able wireless communication systems that would be mounted on Houses, embedded into vehicles and airplanes.


You would need to provide innovative solutions from a process development, investigating new technologies, characterization and analyzing of materials in terms of material surface analysis and treatment, chemical analysis and micro-structures. The work will be with orientation for mass-production under thermal, RF and mechanical constraints.

We do in 6 months what others try to accomplish in 2 years;

You will need to be curios, creative, self-taught, analytical thinker, team player and flexible.

Minimum skills:

  1. Minimum of BSc. in either Chemical or Material Science engineering or Chemistry with emphasis on organic materials.

  2. Experience in organic material, material surface chemistry, thin layers and semiconductors, at least 3 years.

  3. Experience in measurement and characterization method such as HPLC, SEM, AFM and FTIR.


Desired Skills:

  1. MSc or PHd. degree.

  2. Semi-conductor Industry experience, for either silicon manufacturing is a big plus.

  3. High level technical English - Reading, writing and verbal.

MIXED SIGNAL BOARD DESIGN ENG.

Position 107

As a Mixed/Signal Hardware Engineer working for Wafer you would join the Core development team that is now changing the world of wireless communication around the globe. You would lead the development of unique wireless products and system ranging from consumer handheld product and devices to large deployable wireless communication systems that would be mounted on Houses, embedded into vehicles and airplanes.


You would need to provide innovative solutions from a an Mixed signal design perspective, including digital/analog board design, drivers, RF feeding network and control circuitry, DAC, ADC, and RF chains control.

We Appreciate the Innovating mind and our R&D team is Growing Fast, Come Join Us.

Desired Skills:

  1. BSc in Electrical Engineering.

  2. 5+ years of hands on experience as Mixed Signal Design Engineer.

  3. Understanding of architecture considerations, including Analog distribution signal for RF components and transceivers.

  4. HDL (VHDL/Verilog) experience a plus

  5. Strong background in FPGA design and FPGA selection.

  6. Board design experience and leading into mass production a big plus.

  7. Experience integrating Radio systems, and RF board design for various components level

  8. Some transmission line theory knowledge and MW design of passive parts associated with large Radio system chains is a plus.

  9. Layout Experience for Mixed signal and signal integrity big plus.

DIGITAL DESIGN ENG.

Position 108

As a Electronics Hardware Engineer working for Wafer you would join the Core development team that is now changing the world of wireless communication around the globe. You would lead the development of unique wireless products and system ranging from consumer handheld product and devices to large deploy-able wireless communication systems that would be mounted on Houses, embedded into vehicles and airplanes.


You would need to provide innovative solutions from a an electrical design perspective, including digital board design, drivers, electronic control circuitry, DAC, ADC, FPGA and lead that design to mass-production.

We Appreciate the Innovating mind and our R&D team is Growing Fast, Come Join Us.

Desired Skills:

  1. BSc in Electrical Engineering.

  2. 5+ years of hands on experience as digital board design engineer.

  3. Understanding of architecture considerations, including digital interface.

  4. HDL (VHDL/Verilog) experience.

  5. Strong background in FPGA design and FPGA selection.

  6. Board design experience and leading into mass production a big plus.

  7. Experience integrating Radio systems a big plus.

  8. Layout tools and Mixed signal analysis knowhow.

ALGORITHMS AND SIGNAL PROCESSING ENG.

Position 109

As Algorithms Design Engineer working for Wafer you would join the Core development team that is now changing the world of wireless communication around the globe. You would lead the development of unique wireless products and system ranging from consumer handheld product and devices to large deploy-able wireless communication systems that would be mounted on Houses, embedded into vehicles and airplanes.


You would need to provide innovative solutions from an algorithms design perspective, including unique align and track algorithms, detection and classification of signals in time and frequency domain , Integration of a complete system with all the various sensors and sub-systems, Sampling and analysis of various communication, Video and IP signals.


We Appreciate the Innovating mind and our R&D team is Growing Fast, Come Join Us.

Desired Skills: 

  1. MSc in Electrical Engineering or equivalent.

  2. 5+ years of practical experience as an algorithm design engineer

  3. Background in estimation and detection theory

  4. Experience in translation of simulation into real-time system

  5. Experience in radar or satellite systems is a huge advantage

  6. Experience in processing sensors’ data is an advantage

TEST AND AUTOMATION ENG.

Position 110

As Test and Automation Engineer working for Wafer you would join the core development team that is now changing the world of wireless communication around the globe. You would join the team that develops of unique wireless products and system ranging from consumer handheld product and devices to large deploy-able wireless communication systems that would be mounted on Houses, embedded into vehicles and airplanes.


You would need to provide innovative solutions from test and automation perspective, including RF and antenna measurements, developing unique test beds, develop test automation and post-process the results. The position includes bring-up and integration efforts of unique and first of a kind engineering solutions.

We Appreciate the Innovating mind and our R&D team is Growing Fast, Come Join Us.

Desired Skills: 

  1. Electrical Engineering or equivalent.

  2. 5+ years of practical experience as test engineer.

  3. Strong background in RF testing.

  4. Hands-on with RF test equipment including signal generators, spectrum analyzers and network analyzers.

  5. Experience in automating test using Python/LabView/C# etc.

  6. Self-taught.

LAB AND PRODUCTION TECHNICIAN

Position 111

As a technician working for Wafer you would join the core development team that is now changing the world of wireless communication around the globe. You would join the  engineering team's efforts of our core unique wireless products and system ranging from consumer handheld product and devices to large deploy-able wireless communication systems that would be mounted on Houses, embedded into vehicles and airplanes. 


You would need to support various activities in lab including board bring-up and troubleshooting, operating various machines and test equipment, 3D printing , screen printing, operating and maintaining system production machines.


Lab efforts include soldering, constructing test beds and test jigs and general technical approach to various challenges.

Minimum skills:

  1. Technical high-school education.

  2. Military technical background.

  3. At least 3 years of technical employment experience.

  4. Good soldering skills.

  5. Technical intuition.

  6. Positive approach, self motivated and taking initiative are must.

 

CONTACT US

If you have any questions or concerns, please contact us to learn more.